Detailed modeling of integrated IQ-transmitters for 100G+ applications
A. Richter, C. Arellano, D. Carrara, S. Mingaleev, E. Sokolov, and I. Koltchanov,
Proc. SPIE 8284 - Next-Generation Optical Communication: Components, Sub-Systems, and Systems, 82840L - 8 pages (2012).
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We present techniques for modeling the physics and systems-level characteristics of integrated IQ-transmitters for 100G+ applications and emphasize important design aspects. Using time-and-frequency-domain modeling (TFDM) of Photonic Integrated Circuits (PIC), we present a detailed IQ-transmitter model based on the physics and setup of active and passive subcomponents. With this, we link characteristics of subcomponents (bending loss of waveguides, phase changes in MMI couplers, sweep-out time of EAMs) to systems-level characteristics of the integrated IQ-transmitter (extinction ratio, modulation bandwidth, chirp). Further, a behavioral transmitter model is introduced and utilized to assess electrical driving requirements (allowed jitter, noise, synchronization offset).
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